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Linux/Documentation/hwmon/intel-m10-bmc-hwmon.rst

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Diff markup

Differences between /Documentation/hwmon/intel-m10-bmc-hwmon.rst (Architecture sparc) and /Documentation/hwmon/intel-m10-bmc-hwmon.rst (Architecture sparc64)


  1 .. SPDX-License-Identifier: GPL-2.0                 1 .. SPDX-License-Identifier: GPL-2.0
  2                                                     2 
  3 Kernel driver intel-m10-bmc-hwmon                   3 Kernel driver intel-m10-bmc-hwmon
  4 =================================                   4 =================================
  5                                                     5 
  6 Supported chips:                                    6 Supported chips:
  7                                                     7 
  8  * Intel MAX 10 BMC for Intel PAC N3000             8  * Intel MAX 10 BMC for Intel PAC N3000
  9                                                     9 
 10    Prefix: 'n3000bmc-hwmon'                        10    Prefix: 'n3000bmc-hwmon'
 11                                                    11 
 12 Author: Xu Yilun <yilun.xu@intel.com>               12 Author: Xu Yilun <yilun.xu@intel.com>
 13                                                    13 
 14                                                    14 
 15 Description                                        15 Description
 16 -----------                                        16 -----------
 17                                                    17 
 18 This driver adds the temperature, voltage, cur     18 This driver adds the temperature, voltage, current and power reading
 19 support for the Intel MAX 10 Board Management      19 support for the Intel MAX 10 Board Management Controller (BMC) chip.
 20 The BMC chip is integrated in some Intel Progr     20 The BMC chip is integrated in some Intel Programmable Acceleration
 21 Cards (PAC). It connects to a set of sensor ch     21 Cards (PAC). It connects to a set of sensor chips to monitor the
 22 sensor data of different components on the boa     22 sensor data of different components on the board. The BMC firmware is
 23 responsible for sensor data sampling and recor     23 responsible for sensor data sampling and recording in shared
 24 registers. The host driver reads the sensor da     24 registers. The host driver reads the sensor data from these shared
 25 registers and exposes them to users as hwmon i     25 registers and exposes them to users as hwmon interfaces.
 26                                                    26 
 27 The BMC chip is implemented using the Intel MA     27 The BMC chip is implemented using the Intel MAX 10 CPLD. It could be
 28 reprogramed to some variants in order to suppo     28 reprogramed to some variants in order to support different Intel
 29 PACs. The driver is designed to be able to dis     29 PACs. The driver is designed to be able to distinguish between the
 30 variants, but now it only supports the BMC for     30 variants, but now it only supports the BMC for Intel PAC N3000.
 31                                                    31 
 32                                                    32 
 33 Sysfs attributes                                   33 Sysfs attributes
 34 ----------------                                   34 ----------------
 35                                                    35 
 36 The following attributes are supported:            36 The following attributes are supported:
 37                                                    37 
 38 - Intel MAX 10 BMC for Intel PAC N3000:            38 - Intel MAX 10 BMC for Intel PAC N3000:
 39                                                    39 
 40 ======================= ======================     40 ======================= =======================================================
 41 tempX_input             Temperature of the com     41 tempX_input             Temperature of the component (specified by tempX_label)
 42 tempX_max               Temperature maximum se     42 tempX_max               Temperature maximum setpoint of the component
 43 tempX_crit              Temperature critical s     43 tempX_crit              Temperature critical setpoint of the component
 44 tempX_max_hyst          Hysteresis for tempera     44 tempX_max_hyst          Hysteresis for temperature maximum of the component
 45 tempX_crit_hyst         Hysteresis for tempera     45 tempX_crit_hyst         Hysteresis for temperature critical of the component
 46 temp1_label             "Board Temperature"        46 temp1_label             "Board Temperature"
 47 temp2_label             "FPGA Die Temperature"     47 temp2_label             "FPGA Die Temperature"
 48 temp3_label             "QSFP0 Temperature"        48 temp3_label             "QSFP0 Temperature"
 49 temp4_label             "QSFP1 Temperature"        49 temp4_label             "QSFP1 Temperature"
 50 temp5_label             "Retimer A Temperature     50 temp5_label             "Retimer A Temperature"
 51 temp6_label             "Retimer A SerDes Temp     51 temp6_label             "Retimer A SerDes Temperature"
 52 temp7_label             "Retimer B Temperature     52 temp7_label             "Retimer B Temperature"
 53 temp8_label             "Retimer B SerDes Temp     53 temp8_label             "Retimer B SerDes Temperature"
 54                                                    54 
 55 inX_input               Measured voltage of th     55 inX_input               Measured voltage of the component (specified by
 56                         inX_label)                 56                         inX_label)
 57 in0_label               "QSFP0 Supply Voltage"     57 in0_label               "QSFP0 Supply Voltage"
 58 in1_label               "QSFP1 Supply Voltage"     58 in1_label               "QSFP1 Supply Voltage"
 59 in2_label               "FPGA Core Voltage"        59 in2_label               "FPGA Core Voltage"
 60 in3_label               "12V Backplane Voltage     60 in3_label               "12V Backplane Voltage"
 61 in4_label               "1.2V Voltage"             61 in4_label               "1.2V Voltage"
 62 in5_label               "12V AUX Voltage"          62 in5_label               "12V AUX Voltage"
 63 in6_label               "1.8V Voltage"             63 in6_label               "1.8V Voltage"
 64 in7_label               "3.3V Voltage"             64 in7_label               "3.3V Voltage"
 65                                                    65 
 66 currX_input             Measured current of th     66 currX_input             Measured current of the component (specified by
 67                         currX_label)               67                         currX_label)
 68 curr1_label             "FPGA Core Current"        68 curr1_label             "FPGA Core Current"
 69 curr2_label             "12V Backplane Current     69 curr2_label             "12V Backplane Current"
 70 curr3_label             "12V AUX Current"          70 curr3_label             "12V AUX Current"
 71                                                    71 
 72 powerX_input            Measured power of the      72 powerX_input            Measured power of the component (specified by
 73                         powerX_label)              73                         powerX_label)
 74 power1_label            "Board Power"              74 power1_label            "Board Power"
 75                                                    75 
 76 ======================= ======================     76 ======================= =======================================================
 77                                                    77 
 78 All the attributes are read-only.                  78 All the attributes are read-only.
                                                      

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